PRECISE Optical MEASUREMENT

Microstructure testing

Vibration and surface metrology for MEMS

MEMS dynamic response, fully revealed

Laser Doppler vibrometry enables real-time vibration measurement of MEMS
Sub-picometer displacement of resolution up to 8 GHz
Full-field characterization of motion and dynamic behavior beyond electrical testing

Surface structure of MEMS, precisely measured

Non-contact optical metrology measures form, roughness, and surface topography
Coherence scanning interferometry captures millions of height data points within seconds
Reliable characterization of MEMS and microstructures across many materials and surfaces

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MEMS testing solutions in our free webinar

Solutions for MEMS testing using Laser Vibrometry

March 24, 2026 at 11 AM PST

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MSA-600 显微式激光测振仪

MSA-600 显微式激光测振仪专为 MEMS 及显微结构测量而打造,是一款能够获取三维静态与动态特性的一体化光学测量解决方案。它在加速产品开发流程、优化产品质量控制方面表现卓越,甚至可集成至商用探针台,用于晶圆级测试。目前,该仪器的性能已提升至高达 8 GHz。

MSA-650 IRIS 显微式激光测振仪

Polytec全新的最先进的且已获得专利技术的MSA-650 IRIS显微式激光测振仪,是目前世界上唯一能透过硅封装结构(无需拆除硅帽)获取硅器件面内和面外动态特性的系统,测试带宽覆盖DC~25 MHz。

MSA-100-3D 显微式激光测振仪

3D显微式激光测振仪同时记录XYZ三个方向的振动分量,测试带宽覆盖DC~25 MHz,每向的振幅分辨率均达到亚皮米级,可用于面内和面外振动测试。

MSA-060显微式激光测振仪

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Micro.View

TopMap Micro.View® is an easy to use optical profiler in a compact table-top setup. Choose Micro.View® as the cost-effective inspection tool for examining precision-engineered surfaces down to the sub-nm range, for inspecting roughness, microstructures and more surface details.

Micro.View+

Advanced microscope-based surface profiler with automation and color imaging. Micro.View+ enables repeatable, operator-independent roughness and texture analysis—ready for lab and production use.

Dynamic MEMS characterization

Active micro-electromechanical components—such as MEMS actuators and sensors—require advanced measurement technology because electrical testing alone cannot fully reveal their mechanical behavior. Polytec’s MSA Micro System Analyzers provide comprehensive characterization of microsystems by combining high-resolution surface topography with precise measurement of dynamic motion.

Using laser Doppler vibrometry, MSA systems capture micro-scale vibrations and resonances across a broad frequency range up to the GHz level. Engineers can visualize full-field mode shapes with exceptional displacement resolution and true phase information—ideal for design validation, performance optimization, and failure analysis.

With patented IRIS technology, Polytec systems can even measure MEMS dynamics through intact silicon encapsulation, allowing engineers to test devices in their final packaged state without modification. This enables faster development cycles, deeper insight into device behavior, and greater confidence in MEMS performance.

Non-contact analysis of tiny mechanical and biological probes in 3D
Full-field, optical vibration analysis of a combdrive at 6.8 kHz
Micro System Analyzer IRIS using IR laser for measuring MEMS through Si caps in final state
Vibration measurement as a service for modal testing inside Si capped MEMS
MSA-650 IRIS patented measurement technology for analysis on Si capped MEMS
MEMS cantilever resolved in time and frequency domain with optical vibration measurement from Polytec

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Learn about Polytec solutions for Microstructure testing

Static topography measurement of microstructures

Ensure the performance and reliability of MEMS and microstructures with fast, non-contact surface metrology. Because microscopic structures are extremely sensitive, traditional contact measurement methods can alter or damage the sample. Polytec’s optical measurement solutions enable non-destructive surface characterization, allowing engineers to accurately evaluate form, roughness, and structural features without influencing the device.

Polytec TopMap 3D optical profilometers capture millions of height data points across the entire surface in just seconds using coherence scanning interferometry. This enables precise topography measurements on a wide range of materials—from rough CNC-machined surfaces to smooth, highly reflective wafers. Intelligent scanning technology automatically handles varying reflectivity, delivering reliable, repeatable measurements with minimal setup time.

Engineers rely on TopMap systems to quickly analyze microsensors, actuators, sealing surfaces, structured metal sheets, machined components, and biomedical samples. The result is faster development cycles, improved product quality, and greater confidence in microstructure performance.

Areal surface profile of MEMS pressure sensor (courtesy: CIS) as 2D/3D profile. Courtesy: CiS Forschungsinstitut für Mikrosensorik GmbH
Analyze MEMS and microsystems form, topography and capture height data on an entire area
Assesment of biomedical probes like LOC (Lab-on-a-Chip) devices, evaluating channel depth, parallelism or defined micro roughness for fluid transportation
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
Characterizing small details and microstructures with sub-nanometer resolution; sample data of an optical polished surface
Micro roughness with cross section of a wafer surface
Analyze microstructure topography with nanometer resolution

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Our experts are ready to support your projects with tailored measurement solutions or support you in measuring what matters—get in touch with us today.