使用光学测试硅封装MEMS器件内部振动特性

       MEMS器件的动态特性测试和机械响应可视化对于产品开发、故障排除和有限元模型验证来说非常重要。Polytec公司的MSA显微式激光测振仪能快速、准确地测试显微结构的面外振动(OOP)和面内振动(IP)。全新的MSA-650 IRIS显微式激光测振仪甚至可以透过完整的微型硅密封器件进行测试,如惯性传感器,MEMS麦克风,压力传感器等。

Highlights

  • 通过硅封装器件的不同层测试MEMS动态特性
  • 实时面外振动测试,最大带宽高达25 MHz
  • 亚皮米级面外振动位移分辨率
  • MEMS器件的最终有限元模型验证
  • 更好地分离器件的各个层
  • 频闪法测试面内振动,带宽高达2.5 MHz
  • 易于集成至生产线上的自动测试系统(兼容商用探针台)

更好地分离器件的各个层

       MSA-650 IRIS测试系统包括控制器、带有额外参考通道的信号发生器,超高精度红外光源的光学头和强大的配套软件包。其专用的红外相机和低相干SLD源,是在其透过硅帽获取完整硅封装结构在工作条件下的整个层制结构的动态特性的关键。

硅封装MEMS器件的模态测试

        由于硅在波长为1050nm以上的近红外光谱中是透明的,基于红外干涉仪的振动测量技术使得获取密封MEMS器件最真实和最有代表性的振动特性成为可能。

       Polytec全新的最先进的且已获得专利技术的MSA系统能确保最佳数据质量,更好的分离MEMS器件的各个层。MSA-650 IRIS显微式激光测振仪内置专用红外相机和低相干SLD源,是目前世界上唯一能透过硅封装结构获取完整动态特性的系统,其实时面外振动带宽高达25MHz,面内振动分辨率低至30nm。

采用领先的振动分析技术

        为了利用激光多普勒振动测量(LDV)对封装MEMS器件进行深入研究,需要了解硅的光学特性。虽然硅对可见光是不透明的,但它在从波长1050nm起的近红外范围内则显示出良好的透射性。然而也有极限性,在波长为1550 nm时硅的折射率高达3.4,这导致在器件边界处有相当大的菲涅耳反射。

       Poyltec采用低相干光来提高精度,该技术已荣获国际专利。与激光相反,超辐射二极管发出的低相干光只有在干涉仪中的光路与光源的相干长度相等时才会产生干涉,从而将焦点处以外的光排除在外。这一原理被用于白光干涉仪或光学相干层析术,现在首次用于激光多普勒测振仪(LDV)。对MEMS器件进行扫描测试时,带宽高达25 MHz,振幅分辨率达100 fm/ Hz。

Accessories and components

Optical accessories

A-MOB-xxxx Bright Field Objectives

For out-of-plane and in-plane vibration measurement. Available magnifications: 2.5x, 5x, 10x, 20x, 50x.

Tripods, test stands, positioning stages

A-STD-TST-01 Test Stand

Test stand providing ample workspace. With motorized z-axis, travel range 200 mm.

A-STD-BAS-02 Base Stand

Rigid support for the sensor head. Includes manual focus block with 100 mm travel range with coarse and fine drive. Interfaces to commercially available optical tables.

Focus block for microscopic observations and measurements of MEMS with a MSA Micro System Analyzer from Polytec
Focus block for microscopic observations and measurements of MEMS with a MSA Micro System Analyzer from Polytec

A-STD-F50 Focus Block

Travel range 50 mm. With coarse and fine drive for manual z-axis adjustment of the sensor head. Interfaces with commercially available wafer probe stations.

Vibration isolation, breadboards

A-TAB-AIR-01 Active Vibration Isolation Table

Air-damped vibration isolation table with active level adjustment. Compatibility: A-STD-TST-01 Test Stand, A-STD-BAS-02 Base Stand.

A-TAB-ELC-01 Active Vibration Isolation Table

Electronically controlled voice coil stabilization for highest isolation performance. Compatibility: A-STD-TST-01 Test Stand, A-STD-BAS-02 Base Stand.

Breadboard for optical testing of MEMS and microstructures with MSA Micro System Analyzers from Polytec
Breadboard for optical testing of MEMS and microstructures with MSA Micro System Analyzers from Polytec

A-BBO-ME02 Breadboard

Breadboard with metric hole pattern. Footprint 900 mm x 600 mm. Compatibility: A-STD-BAS-02 Base Stand.

Breadboard for optical MEMS testing with a MSA Micro System Analyzer from Polytec
Breadboard for optical MEMS testing with a MSA Micro System Analyzer from Polytec

A-AVI-MELA Active Vibration Isolation Breadboard

Electronically controlled for highest vibration isolation performance. With metric hole pattern. Footprint 600 x 800 mm. Compatibility: A-STD-BAS-02 Base Stand.

Miscellaneous

Probe station for wafer level testing of MEMS and microstructures with a Polytec MSA Micro System Analyzer
Probe station for wafer level testing of MEMS and microstructures with a Polytec MSA Micro System Analyzer

A-SPK-0008 Wafer Prober Module

Together with the A-PST-200P XY Positioning Stage, the wafer prober module forms a motorized platform for electrical contacting and high-precision measurement of wafers and substrates up to 200 mm in diameter.

Vaccuum chamber for microstructure analysis with Polytec MSA Micro System Analyzers
Vaccuum chamber for microstructure analysis with Polytec MSA Micro System Analyzers

A-SPK-0010 Vacuum Prober Module

Vacuum and purge lines. Micro manipulator for handling of four electrical probes.


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