MEMS dynamic response, fully revealed
- Laser Doppler vibrometry enables real-time vibration measurement of MEMS
- Sub-picometer displacement of resolution up to 8 GHz
- Full-field characterization of motion and dynamic behavior beyond electrical testing
Surface structure of MEMS, precisely measured
- Non-contact optical metrology measures form, roughness, and surface topography
- Coherence scanning interferometry captures millions of height data points within seconds
- Reliable characterization of MEMS and microstructures across many materials and surfaces
Learn more about
MEMS testing solutions in our free webinar
Learn more about
MEMS testing solutions in our free webinar
Solutions for MEMS testing using Laser Vibrometry
March 24, 2026 at 11 AM PST
Related products

マイクロシステムアナライザ MSA-600
MSA-600 は、MEMS や微細構造の静的・動的な 3D 特性を測定するオールインワン光学測定ソリュー ションで、最大 8GHz まで対応します。MSA-600は、マイクロシステム開発および品質検査を強化し、市販のプローブステーションに組み込むことにより、ウェーハレベルでのテストも可能にします。

マイクロシステムアナライザ MSA-650 IRIS
MSA-650 IRIS マイクロシステムアナライザ は、赤外線レーザを採用した特許取得済みの革新的な顕微鏡型レーザドップラ振動計で、測定周波数帯域は最大25 MHzで、シリコンキャップ越しにマイクロシステムを測定することができ、デバイスに接触したりデキャップすることなく、真のMEMSダイナミクスを明らかにします。

マイクロシステムアナライザ MSA-100-3D
MSA-100-3Dは、3次元におけるXYZ3軸振動成分を一度に測定します。非接触光学測定でありながら、面内および面外振動成分の両方において、DCから最大25MHzまでの高分解能3D振動解析をサブピコメートルレベルの振幅分解能で実現します。

マイクロシステムアナライザ MSA-060
顕微鏡型レーザドップラ振動計のエントリモデルです。他のモデルはレーザが測定物表面をスキャンするのに対し、MSA-060は電動ステージによる多点計測で、DCから24 MHzの小さな部品の表面全体の振動を非接触で測定、可視化することができます。

Micro.View
TopMap Micro.View® is an easy to use optical profiler in a compact table-top setup. Choose Micro.View® as the cost-effective inspection tool for examining precision-engineered surfaces down to the sub-nm range, for inspecting roughness, microstructures and more surface details.

Micro.View+
Advanced microscope-based surface profiler with automation and color imaging. Micro.View+ enables repeatable, operator-independent roughness and texture analysis—ready for lab and production use.
Dynamic MEMS characterization
Active micro-electromechanical components—such as MEMS actuators and sensors—require advanced measurement technology because electrical testing alone cannot fully reveal their mechanical behavior. Polytec’s MSA Micro System Analyzers provide comprehensive characterization of microsystems by combining high-resolution surface topography with precise measurement of dynamic motion.
Using laser Doppler vibrometry, MSA systems capture micro-scale vibrations and resonances across a broad frequency range up to the GHz level. Engineers can visualize full-field mode shapes with exceptional displacement resolution and true phase information—ideal for design validation, performance optimization, and failure analysis.
With patented IRIS technology, Polytec systems can even measure MEMS dynamics through intact silicon encapsulation, allowing engineers to test devices in their final packaged state without modification. This enables faster development cycles, deeper insight into device behavior, and greater confidence in MEMS performance.






Get in touch with our experts
Get in touch with our experts
Learn about Polytec solutions for Microstructure testing
Static topography measurement of microstructures
Ensure the performance and reliability of MEMS and microstructures with fast, non-contact surface metrology. Because microscopic structures are extremely sensitive, traditional contact measurement methods can alter or damage the sample. Polytec’s optical measurement solutions enable non-destructive surface characterization, allowing engineers to accurately evaluate form, roughness, and structural features without influencing the device.
Polytec TopMap 3D optical profilometers capture millions of height data points across the entire surface in just seconds using coherence scanning interferometry. This enables precise topography measurements on a wide range of materials—from rough CNC-machined surfaces to smooth, highly reflective wafers. Intelligent scanning technology automatically handles varying reflectivity, delivering reliable, repeatable measurements with minimal setup time.
Engineers rely on TopMap systems to quickly analyze microsensors, actuators, sealing surfaces, structured metal sheets, machined components, and biomedical samples. The result is faster development cycles, improved product quality, and greater confidence in microstructure performance.








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