Characterizing vertical interconnect accesses (VIA)
Vertical electrical connections – also known as “vertical interconnect accesses” or VIAs for short – are mainly used in high-density, integrated switching circuits and have structures with a high aspect ratio. TSVs (through silicon VIAs) in particular have become an established technology in the semiconductor segment.
Polytec's optical surface metrology allows easy and reliable quality inspections: check etching depths in automated processes, measure distances and surface parameters on VIA. Chromatic confocal sensors and microscope-based profilers offer versatile measurement capabilities, for both in the laboratory and at production level and inline.
Fitting surface profilers
Micro.View
TopMap Micro.View® is an easy to use optical profiler in a compact table-top setup. Choose Micro.View® as the cost-effective inspection tool for examining precision-engineered surfaces down to the sub-nm range, for inspecting roughness, microstructures and more surface details.
Micro.View+
Advanced microscope-based surface profiler with automation and color imaging. Micro.View+ enables repeatable, operator-independent roughness and texture analysis—ready for lab and production use.
Pro.Surf+
Multi-sensor optical profiler combining large-area form measurement with integrated roughness analysis. Pro.Surf+ delivers fast, traceable form and roughness results in one production-ready system.
Choose the right surface profiler with confidence—benefit from our "try before buy" approach.
Fitting application and measurement tasks
Discuss your demands with our experts
Let’s start with a short discussion about your parts, tolerances, and workflow — and, if useful, we can add a feasibility study, PolyMeasure (contract measurements), or a PolyRent trial as optional next steps.
