Reliable die bonding

Accurate die placement and bond line thickness are critical for stable processes and high-quality electronic components.

Control epoxy die bonding by surface characterization

In epoxy die bonding and related die attach processes, even small deviations can affect process stability, component reliability, and lifetime. Key quality indicators such as bond line thickness (BLT), die tilt, and positioning accuracy must therefore be monitored reliably and reproducibly.

Polytec’s TopMap optical surface profilers enable fast, non-contact inspection of epoxy die bonding processes. They provide precise 3D surface data for automated quality control — from die orientation and tilt to bond line thickness — directly in production environments.

Characterizing QFN packages (quad-flat no-leads)

TopMap 3D surface metrology solutions integrate easily into production lines and deliver automated, high-resolution in-process measurements for epoxy die bonding. Typical inspection tasks include:

  • Die tilt and die positioning
  • Bond line thickness (BLT) and BLT height
  • Torsion and relative positioning to reference features

In QFN packages, the die attach fillet — the adhesive excess rising along the die edges — plays a key role in mechanical stability. Based on precise BLT measurements, relevant parameters such as fillet width, height, and slope angle can be evaluated and optimized to improve process robustness and component quality.

Scheme of epoxy die bonding on IC, showing die attach on the lead frame
Determining bond line thickness as key quality indicator for the die bonding process
Measuring the BLT bond line thickness on an IC
Epoxy die bonding chip placement positioning quality control
Areal surface characterization can determine bond line thickness, slope angle for monitoring the die attach process 

Bond line thickness, film and layer thickness measurement in 3D 

Discuss your demands with our experts

Let’s start with a short discussion about your parts, tolerances, and workflow — and, if useful, we can add a feasibility study, PolyMeasure (contract measurements), or a PolyRent trial as optional next steps.

Schedule your surface profiler demonstration