Industrial large-area profilers for non-contact quality control 

→ Measure large-area form and roughness with one system

Chromatic-confocal sensor (400 µm range, ~2.6 µm lateral resolution, 10.8 mm working distance) adds roughness in the same station; typical roughness measurement Ra ≥ 100 nm.

• Combine form + roughness in one pass
• Long working distance for safe sample handling

→ True Stitching provides highest precision when scanning wide-area samples

Because larger surfaces exceed the single-shot field of view—stitching merges tiles into one accurate dataset. The metrology quality of such large-area measurements depends on the optics and sensing technology, the number of tiles and the stitching algorithms. 

True Stitching delivers high-fidelity large-area measurements by minimizing stitching artifacts and preserving geometry.

In an independent benchmark at a leading German technical university, six optical profilers from different manufacturers were compared, and the Polytec profilometer demonstrated the highest stitching and measurement quality. This was achieved through several key features:

• Large single-shot FoV → fewer tiles and seams, less cumulative error
• Sophisticated stitching algorithms → controlled overlap, robust registration, and metrology-safe blending that preserves steps and edges
• For Pro.Surf: Telecentric/CSI optics with correlogram evaluation → stable geometry and height fidelity across tiles

The result is high-fidelity, large-area topography with fewer artifacts and audit-ready residuals—what we call True Stitching.

→ Keeps geometry accurate across height and dept

Traceably calibrated WLI/CSI delivers non-contact, areal 3D data with nanometer vertical resolution. The telecentric optical approach keeps the beams / rays parallel to the optical axis, preserving constant magnification and uniform illumination over height—even enabling measurements in holes.

• Non-contact, repeatable, fast areal scans
• Phase/envelope evaluation for smooth and rough surfaces
• Smart Scanning Technology with dynamic range handle both both rough to shiny - low to high reflecting surface areas
• Long-life 525 nm LED

→ Reduces stitching and cycle time

Pro.Surf offers a wide single-shot field of view up to 44.9 × 33.8 mm (with ~1.91 million points), so broader samples or multiple parts can be measured in a single acquisition. With the built-in stitching function, coverage extends up to ~228 × 221 mm.

• Measure multiple samples at once; automatic sample recognition available
• Short cycle times; reduced stitching effort

→ Stabilizes results in real shopfloor environments

Noise and ambient vibration on classic machine shops can affect precision measurements. The patented ECT Environmental Compensation Technology compensates for such disturbances, ensuring consistent data even in noisy production environments.

• Improves reliability in noisy or unstable environments
• Enables automation and inline QC without full isolation
• Especially helpful for sensitive components (e.g., MEMS, thin films)

→ Enables unattended, repeatable measurements

The modular design and motorization options make it easy to automate and integrate the Pro.Surf profilometer into existing processes and machines. A bundle of features and capabilities enables highly efficient and unattended metrology workflows:

• Pattern matching and Smart Scanning Technologies
• Motorized X, Y, Z, tip/tilt stages
• Large FoV and automated stitching for high-resolution scans over large areas
• Recipe system in TMS (Software) for operator-independent workflows
• Rugged design without external moving parts and ECT (environmental compensation technology)

Machine-vision routine that finds and registers parts against a template so recipes hit the right locations—even if parts are shifted or rotated. This reduces the costs and handling effort for fixtures and makes the measurement much easier. Ideal for trays and multi-sample runs.

Dynamic range that adapts to varying reflectivity/contrast so you can measure “almost any surface” from matte or dark to shiny, from low to high reflecting areas in one setup in the TopMap Software.