Characterizing vertical interconnect accesses (VIA)
Vertical electrical connections – also known as “vertical interconnect accesses” (VIAs) for short – are mainly used in high-density, integrated switching circuits and have structures with a high aspect ratio. TSVs (through silicon VIAs) in particular have become an established technology in the semiconductor segment.
Polytec’s sophisticated quality products allow you to easily, automatically and reliably check etching depths, distances and surface parameters. Chromatic confocal sensors and microstructure specialists offer versatile measurement capabilities, both in the lab and in production.