Efficiently measuring MEMS right on the wafer
Wafer-level testing prior to separating the chips allows the sorting-out of bad dies in an early stage of the production process, which helps significantly to keep MEMS production costs low while maintaining high yield and quality levels. While electrical test procedures are standard here, certain tasks are necessary to verify directly the mechanical function, typically by optical measurement.
With Polytec solutions and the MSA Micro System Analyzer product line integrated into virtually all commercially available wafer probes, the comprehensive and reliable testing begins. By combining a (semi)-automatic probe station with a microscope-based scanning laser vibrometer, efficiently and quickly measure the dynamic behavior of MEMS right on the wafer. Achieve higher throughput and use it as key tool for monitoring the production process.
Time domain of switching behavior of RF switches
Time domain measurement of RF-MEMS switches on wafer level
Microstructure characterization
Related products
MSA IRIS measurement service
This brand new, patented measurement technology allows for comprehensive and representative analysis of Si encapsulated MEMS, measuring dynamics right through silicon caps. Our PolyXperts are looking forward to receiving your capped MEMS samples for modal testing, feasibility studies and consulting throughout all phases from development over prototyping to manufacturing of your encapsulated microstructures.
MSA-600 Micro System Analyzer
The all-in-one optical measurement solution for static and dynamic 3D characterization of MEMS and microstructures- now for up to 8 GHz! The MSA-600 enhances microsystem development and quality inspections - also allowing testing on wafer-level when integrated into commercially available probe stations.
MSA-100-3D Micro System Analyzer
The 3D Micro System Analyzer records vibration components in all three spatial directions at once. The optical measurement system enables high-resolution 3D vibration analysis from DC up to 25 MHz with amplitude resolutions in the sub-picometer range, for both in-plane and out-of-plane vibration components.
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