微系統與MEMS的拓撲結構與動態特性分析微系統與MEMS的拓撲結構與動態特性分析
採用Polytec多功能表面測量系統，您能以高度精準、快速且可靠的方式完成微納科技任務。 您可量測晶片實驗室的溝槽深度、測定MEMS封裝的階梯高度、評估壓力感測器的平面度，並透過表面參數分析MEMS元件。如今，即使對射頻濾波器執行動態面外與面內測量以判定MHz級諧振頻率，對您而言也將是輕而易舉之事——這全仰仗Polytec的 MSA 微系統分析儀系列。
微光學轮廓仪與振動計應用於微米與奈米科技領域
巨觀分析器
Pro.Surf systems enable fast, area-based 3D topography measurements with telecentric optics. They support reliable inspection of flatness, shape, parallelism and step heights across wide fields of view and in-bore features.
微型分析儀
Micro.View systems are optimized for ultra-high-resolution measurements in the sub-nanometer range. With focused optics and high vertical resolution they enable detailed analysis of microstructures, surface finish and material distribution where even the smallest deviations matter.
显微式激光测振仪
随着微机电系统和MEMS快速发展，Polytec推出了高度创新的显微式测量系统产品线。Polytec的MSA系列显微式激光测振仪带宽可达数kHz，数MHz，甚至数GHz，以最高精度可靠地验证微系统的动力学特性和轮廓数据。MSA集多功能于一体，可用于确定传递函数、表征微器件的3D静态和动态特性，甚至可透过封装好的硅帽，获取其在工作条件下的整个层制结构。
相關應用程式
微機電系統壓力感測器
Surface characterization of MEMS pressure sensors for optimal quality & production control. Explore more about measuring MEMS pressure sensors.
垂直互連存取（VIA）
Reliable quality inspections: check etching depths in automated processes, measure distances and surface parameters on Vertical interconnect accesses.
柔性電子學
Polytec optical systems ensure process control and tolerance checks in printed and in-foil hybrid electronics with integrated chips
晶粒鍵合
In epoxy die bonding, the accurate placement & attachment of the die is crucial for quality. Ask for TopMap surface metrology for die bonding process control.
晶片實驗室
Test your lab-on-a-chip devices (LoC) using 3D measurement data evaluating form parameters for quality control: channel depth, step height and flatness.
