Close-up of epoxy die bonded semiconductor chip with fine wire bonding on a gold-plated lead frame for electronic component assembly.

Reliable die bonding

Accurate die placement and bond line thickness are critical for stable processes and high-quality electronic components.

Control epoxy die bonding by surface characterization

In epoxy die bonding and related die attach processes, even small deviations can affect process stability, component reliability, and lifetime. Key quality indicators such as bond line thickness (BLT), die tilt, and positioning accuracy must, therefore, be monitored reliably and repeatably.

Polytec’s TopMap optical surface profilers enable fast, non-contact inspection of epoxy die bonding processes. They provide precise 3D surface data for automated quality control — from die orientation and tilt to bond line thickness — directly in production environments.

Characterizing QFN packages (quad-flat no-leads)

TopMap 3D surface metrology solutions integrate easily into production lines and deliver automated, high-resolution in-process measurements for epoxy die bonding. Typical inspection tasks include:

  • Die tilt and die positioning
  • Bond line thickness (BLT) and BLT height
  • Torsion and relative positioning to reference features

In QFN packages, the die attach fillet — the adhesive excess rising along the die edges — plays a key role in mechanical stability. Based on precise BLT measurements, relevant parameters such as fillet width, height, and slope angle can be evaluated and optimized to improve process robustness and component quality.

Cross-section schematic of epoxy die bonding showing die placement, fillet height, bond line thickness, and lead frame die paddle.
Scheme of epoxy die bonding on IC, showing die attach on the lead frame
Cross-sectional diagram showing bond line thickness measurement in epoxy die bonding for IC on lead frame with adhesive layer.
Determining bond line thickness as key quality indicator for the die bonding process
3D surface profile highlighting bond line thickness measurement on an IC chip with color scale from red to blue for epoxy die bonding quality control.
Measuring the BLT bond line thickness on an IC
3D color-coded epoxy die bonding surface map showing chip placement accuracy and bond line thickness for quality control.
Epoxy die bonding chip placement positioning quality control
3D surface map highlighting bond line thickness and slope angle for epoxy die attach process quality control.
Areal surface characterization can determine bond line thickness, slope angle for monitoring the die attach process 

Bond line thickness, film and layer thickness measurement in 3D 

Discuss your demands with our experts

Let’s start with a short discussion about your parts, tolerances, and workflow—and, if useful, we can add a feasibility study, PolyMeasure (contract measurements), or a PolyRent trial as optional next steps.

Schedule your surface profiler demonstration

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