User Insights for Your Work
过去35年间，Polytec已在德国总部成功举办了18届测振仪用户交流会。在此基础上，Polytec现欣然宣布，将于2026年推出微结构用户交流会。这一国际盛会旨在汇聚专家与业界人士，共同探讨MEMS、超声换能器、声波器件及其他微结构应用中光学振动测量的前沿发展。
诚邀您于3月19日（星期四）莅临德国瓦尔德布隆的Polytec总部，参与为期一天的精彩演讲、互动讨论与交流合作。我们的目标是打造一个高端平台，促进知识共享、激发创新思维，并拓展超越现有社群的合作网络。
Be part of the Microstructure User Meeting 2027
Would you like to attend the Microstructure User Meeting 2027—or share your expertise with the community as a speaker?
- Leave your contact details in the form below to receive early updates on the event, including programme details, registration and opportunities to contribute.
- We will notify you by email as soon as new information becomes available.
会议核心议题
- MEMS微镜
- MEMS麦克风
- MEMS膜片与压力传感器
- CMUT与PMUT
- 惯性传感器
- MEMS器件晶圆级测试
- SAW元件与微流控
- 悬臂梁与AFM探针
参会理由
The Polytec Microstructure User Meeting is a focused international event that brings together experts and practitioners in the field of microstructure dynamics and MEMS characterization.
Polytec微结构用户交流会是一场聚焦国际的盛会，汇聚了微结构动力学与MEMS表征领域的专家与从业人员。为期一天的会议提供了高端知识交流平台，促进产业与研究机构的合作，探索光学微结构测量的最新趋势与应用。
- 主题演讲
- 报告与应用展示
- 微系统动手实操工作坊
- 最新测量与测试系统展示
- 交流机会
- 午餐与咖啡
Share your expertise at the Microstructure User Meeting 2027
Are you working on innovative MEMS, microsystem or microstructure applications? We invite researchers, engineers and industry experts to share their experience, measurement challenges and application insights with the community.
- If you are interested in presenting your work at the Microstructure User Meeting 2027, let us know using the form below.
- We will keep you informed about upcoming speaker opportunities, submission details and event updates.
The second Polytec Microstructure User Meeting 2026 was a great success. On 19 March 2026, experts and practitioners from around the world met at Polytec headquarters in Waldbronn to discuss current developments in optical vibration measurement of microstructures.
Following the first Microstructure User Meeting, held on 24 October 2019, and building on Polytec’s long-standing Vibrometer User Meeting tradition, the event provided a dedicated forum for the MEMS and microsystems community. The highly positive feedback from participants confirmed that this format meets a clear need across the field.
10 technical presentations from industry and researchTU Wien, HSG, Fraunhofer ENAS, Fraunhofer ISIT, Friedrich-Alexander-Universität Erlangen-Nürnberg, Leibniz-Institut IFW, CEA-Leti Grenoble, IMMS GmbH and Polytec. |
Hands-on microsystems workshopLive demonstrations with Polytec MSA systems and laboratory tours during the pre-event programme. |
International expert networkParticipants from research institutes and industry worldwide, with all presentations delivered in English. |
Ice Breaker DinnerAn informal evening on 18 March provided a relaxed start to the meeting and enabled early networking. |
Free attendanceThe meeting was free of charge for all participants, including catering and event materials. |
"The MSA was a game changer for us. To correlate the modes to spektra was so important for us."
"Since our measurements sometimes take days, we have to be sure
that the measurement system is stable the whole time."
"Please keep the „Bring Your Sample“ philosophy."
报告议程
Presentations and speakers
| Topic | Presentation · Speaker |
|---|---|
| Piezoelectric microsystems | Piezoelectric microsystems at TU Wien Assoc.Prof. Michael Schneider, Institut für Sensor- und Aktuatorsysteme · TU Wien |
MEMS PMUT and encapsulated inertial sensors
| Characterization of resonant MEMS-PMUTs and encapsulated inertial sensors – at wafer level Dr. Roman Forke and Sven Voigt · FHI-ENAS |
| MEMS microphones | Three-dimensional folded MEMS platform for area-efficient piezoelectric sensors and actuators Dr. Achim Bittner · HSG |
| LIDAR micromirrors | Development and optimization of micromirrors for LIDAR applications Dr. Jeong-Yeon Hwang · FHI-ISIT |
| HQ mechanical oscillators | Highest-quality-factor mechanical oscillators as components for future quantum technologies Prof. Heiko Weber · FAU Erlangen |
| SAW microacoustic devices | Materials for the technologies of tomorrow: Advanced in-situ characterization of surface acoustic wave based microacoustic devices Dr. Hagen Schmidt · Leibniz-Institut IFW |
| Response functions around 5 GHz | Demonstrating MSA-600-S capabilities to understand electrical response of a BAW resonator around 5 GHz Dr. Alexandre Reinhardt · CEA-Leti Grenoble |
| Wafer mapping prober | Wafer mapping using versatile automatic Prober TS2000 in combination with Micro System Analyzer Volker Hänsel · MPI/ATV |
| Parameter extraction | Parameter extraction at wafer level for process monitoring in semiconductor manufacturing Steffen Michael · IMMS GmbH |
3月18日（星期三）下午计划举办“动手实操环节”及“破冰晚宴”，敬请预留时间并保持关注。请注意，所有报告及会议语言均为英语。
Hands -on Applications & Demo setups
Microstructure User Meeting 2026 | International Conference Highlights
激光振动测量如何助力研发
Laser vibrometry focusing on the small details
- Characterize small and delicate structures in a non-contact way.
- Analyze vibrations, acoustics and dynamics.
- Measure biomedical samples, electronic components and microstructures like MEMS using light, without mass-loading, and from DC up to the GHz range on a large bandwidth.
Laser vibrometers focus on the small details, measuring deflection shapes for model validation. They assess the frequency response and determine resonance frequency, impulse response, and Q-factor.
No matter how big or small – Polytec vibrometers measure it!
相关光学测量系统:
MSA-100-3D显微式激光测振仪
3D显微式激光测振仪可同时记录三个空间方向上的振动分量。其光学测量系统能够对平面内和平面外的振动分量进行高分辨率的三维振动分析，频率范围从直流到25 MHz，振幅分辨率可达亚皮米量级。
MSA-600显微式激光测振仪
MSA-600显微式激光测振仪专为MEMS与微结构测量打造，集成三维静态与动态特性测试能力，是一款一体化光学测量解决方案。其在加速产品研发流程、强化质量管控方面表现出色，并可集成至商用探针台用于晶圆级测试。目前测量频率已扩展至8 GHz。
MSA-060显微式激光测振仪
使用MSA-060显微式激光测振仪，踏入微系统振动分析领域。该设备能够以激光级精度，对小型组件和微系统的振动及动力学特性进行全表面范围的记录和可视化，测量频率范围从直流（DC）到24 MHz。微系统分析仪利用测量激光，以完全非接触、非侵入的方式揭示小型组件的真实动力学特性。
VibroScan QTec Neo
VibroScan QTec Neo 以一种全新的方式测量振动——非接触式、全场测量，且精度前所未有。QTec® 技术首次成功从红外短波红外（SWIR）激光器转移至可见光氦氖激光器。这款高精度氦氖激光器具有微小的激光测量光斑，适用于对最精细结构的测量，甚至可在水中及穿透水体进行测量。QTec® 始终确保信号稳定并提供最佳信噪比。VibroScan QTec Neo 集成了数据采集和最高达32 MHz的信号发生器，确保了极高的便携性。
