Microstructure User Meeting 2027

Symposium on Optical Vibration Measurement
November 2027, Waldbronn

User Insights for Your Work

Polytec is excited to launch the 3rd Microstructure User Meeting 2027. This international event will bring together experts and practitioners to explore cutting-edge developments in optical vibration measurement for MEMS, ultrasonic transducers, acoustic waves, and other microstructure applications. 

Join us in November 2027, at Polytec Headquarters in Waldbronn, Germany, for a day of inspiring presentations, interactive discussions, and collaborative networking. Our aim is to create a high-level platform where knowledge is shared, new ideas emerge, and connections extend beyond our existing community.

Be part of the Microstructure User Meeting 2027 

Would you like to attend the Microstructure User Meeting 2027—or share your expertise with the community as a speaker? 

  • Leave your contact details in the form below to receive early updates on the event, including programme details, registration and opportunities to contribute.
  • We will notify you by email as soon as new information becomes available.
Technical focus

Topics covered at the meeting

MEMS Mirrors
Characterisation and dynamic analysis of MEMS mirrors, including applications for LIDAR.
MEMS Microphones
Measurement approaches for the acoustic characterisation of MEMS microphones.
MEMS Membranes and Pressure Sensors
Vibration analysis of membranes and pressure sensors.
CMUT & PMUT
Capacitive and piezoelectric micromachined ultrasonic transducers.
Inertial Sensors
Optical measurement of inertial sensors and packaged microsystems.
Wafer Mapping of MEMS Devices 
Area-wide characterisation of complete wafers with automated probers.
SAW Components & Microfluidics
Surface acoustic waves and microfluidic applications.
Cantilevers and AFM Tips
Dynamic measurements of cantilevers and atomic-force-microscopy probes.

Why you should attend

The Polytec Microstructure User Meeting is a focused international event that brings together experts and practitioners in the field of microstructure dynamics and MEMS characterization.

 This one-day meeting offers a high-level platform for knowledge exchange, fostering collaboration between industry and research, and exploring the latest trends and applications in optical measurement of microstructures.

  • Keynotes
  • Presentations and Applications
  • Hands-On Microsystems Workshop
  • Latest Measurement and Testing Systems
  • Networking Opportunities
  • Lunch + Coffee

Share your expertise at the Microstructure User Meeting 2027

Are you working on innovative MEMS, microsystem or microstructure applications? We invite researchers, engineers and industry experts to share their experience, measurement challenges and application insights with the community.

  • If you are interested in presenting your work at the Microstructure User Meeting 2027, let us know using the form below. 
  • We will keep you informed about upcoming speaker opportunities, submission details and event updates.
Recap 2026

Microstructure User Meeting 2026: A Growing Forum for the Community

The second Polytec Microstructure User Meeting 2026 was a great success. On 19 March 2026, experts and practitioners from around the world met at Polytec headquarters in Waldbronn to discuss current developments in optical vibration measurement of microstructures.

Following the first Microstructure User Meeting, held on 24 October 2019, and building on Polytec’s long-standing Vibrometer User Meeting tradition, the event provided a dedicated forum for the MEMS and microsystems community. The highly positive feedback from participants confirmed that this format meets a clear need across the field.

10 technical presentations from industry and research

TU Wien, HSG, Fraunhofer ENAS, Fraunhofer ISIT, Friedrich-Alexander-Universität Erlangen-Nürnberg, Leibniz-Institut IFW, CEA-Leti Grenoble, IMMS GmbH and Polytec.

Hands-on microsystems workshop

Live demonstrations with Polytec MSA systems and laboratory tours during the pre-event programme.

International expert network

Participants from research institutes and industry worldwide, with all presentations delivered in English.

Ice Breaker Dinner

An informal evening on 18 March provided a relaxed start to the meeting and enabled early networking.

Free attendance

The meeting was free of charge for all participants, including catering and event materials.

"The MSA was a game changer for us.  To correlate the modes to spektra was so important for us."

Prof. Heiko Weber
Friedrich-Alexander-Universität Erlangen

"Since our measurements sometimes take days, we have to be sure  

that the measurement system is stable the whole time."

 

"Please keep the „Bring Your Sample“ philosophy."

Steffen Michael
IMMS GmbH Ilmenau
Programme 2026

Presentations and speakers

TopicPresentation · Speaker
Piezoelectric microsystems

Piezoelectric microsystems at TU Wien

Assoc.Prof. Michael Schneider, Institut für Sensor- und Aktuatorsysteme · TU Wien

MEMS PMUT and encapsulated inertial sensors

 

Characterization of resonant MEMS-PMUTs and encapsulated inertial sensors – at wafer level

Dr. Roman Forke and Sven Voigt · FHI-ENAS

MEMS microphones

Three-dimensional folded MEMS platform for area-efficient piezoelectric sensors and actuators

Dr. Achim Bittner · HSG

 LIDAR micromirrors

Development and optimization of micromirrors for LIDAR applications

Dr. Jeong-Yeon Hwang · FHI-ISIT

HQ mechanical oscillators

Highest-quality-factor mechanical oscillators as components for future quantum technologies

Prof. Heiko Weber · FAU Erlangen

SAW microacoustic devices

Materials for the technologies of tomorrow: Advanced in-situ characterization of surface acoustic wave based microacoustic devices

Dr. Hagen Schmidt · Leibniz-Institut IFW

Response functions around 5 GHz

Demonstrating MSA-600-S capabilities to understand electrical response of a BAW resonator around 5 GHz

Dr. Alexandre Reinhardt · CEA-Leti Grenoble

Wafer mapping prober

Wafer mapping using versatile automatic Prober TS2000 in combination with Micro System Analyzer

Volker Hänsel  · MPI/ATV

Parameter extraction

Parameter extraction at wafer level for process monitoring in semiconductor manufacturing

Steffen Michael · IMMS GmbH

Live demonstrations 2026

Hands -on Applications & Demo setups

MEMS Micro Mirror for LiDAR, damping, resonant frequencies and shapes
Si-capped MEMS, measuring inplane and out of plane dynamics
Surface acoustic wave (SAW)
Automated process monitoring of MEMS on waferlevel

Microstructure User Meeting 2026 | International Conference Highlights

Interesting applications

Electronics, semiconductors and solar

 

Polytec’s optical vibration sensors with laser vibrometers are indispensable tools for you – whether you’re carrying out dynamic tests in research, design and industrial testing, or monitoring processes such as the bond process when manufacturing power electronics.

Learn more

Microtechnology and nanotechnology

Precise, reliable and fast measuring technology for characterizing and monitoring the quality of devices is decisive in developing and producing microsystems. This is all the more important since microsensors are increasingly taking over safety-related tasks too – placing high demands on reliability and functional safety.

Learn more

How laser vibration measurement helps in R&D

Laser vibrometry focusing on the small details
  • Characterize small and delicate structures in a non-contact way. 
  • Analyze vibrations, acoustics and dynamics. 
  • Measure biomedical samples, electronic components and microstructures like MEMS using light, without mass-loading, and from DC up to the GHz range on a large bandwidth. 

Laser vibrometers focus on the small details, measuring deflection shapes for model validation. They assess the frequency response and determine resonance frequency, impulse response, and Q-factor. 

No matter how big or small – Polytec vibrometers measure it!

Associated Optical Measurement Systems

マイクロシステムアナライザ MSA-100-3D

MSA-100-3Dは、3次元におけるXYZ3軸振動成分を一度に測定します。非接触光学測定でありながら、面内および面外振動成分の両方において、DCから最大25MHzまでの高分解能3D振動解析をサブピコメートルレベルの振幅分解能で実現します。

マイクロシステムアナライザ MSA-600

MSA-600 は、MEMS や微細構造の静的・動的な 3D 特性を測定するオールインワン光学測定ソリュー ションで、最大 8GHz まで対応します。MSA-600は、マイクロシステム開発および品質検査を強化し、市販のプローブステーションに組み込むことにより、ウェーハレベルでのテストも可能にします。

マイクロシステムアナライザ MSA-060

顕微鏡型レーザドップラ振動計のエントリモデルです。他のモデルはレーザが測定物表面をスキャンするのに対し、MSA-060は電動ステージによる多点計測で、DCから24 MHzの小さな部品の表面全体の振動を非接触で測定、可視化することができます。

VibroScan QTec Neo Scanning Vibrometer

VibroScan QTec Neo

VibroScan QTec Neoは、振動を非接触、全視野、前例のない精度で測定する新しいソリューションです。ポリテックは世界で初めて赤外線SWIRレーザから可視光のヘリウムネオンレーザへ、QTec®テクノロジーの拡張に成功しました。レーザスポットが小さい高精度ヘリウムネオンレーザは、微細構造の測定や水中または水中を透過しての測定に適しています。QTec®は常に安定した測定と最高の信号対雑音比を提供します。VibroScan QTec Neoは、最大32MHzの信号発生器を内蔵しつつも、統合されたデータ取得により最大限の携帯性を保証します。

Service

Optical testing of capped MEMS as service

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