TopMap Micro.View+

TopMap Micro.View+新一代光学表面轮廓仪，以模块化理念精心设计，功能完备，可依据特定应用需求进行个性化定制配置。

Micro.View + 在表面粗糙度、纹理以及微观结构形貌分析方面表现卓越，能提供极为详尽的分析结果。它创新性地将三维数据与色彩信息融合，不仅能实现令人称奇的可视化效果，还可开展诸如缺陷详细记录等拓展性分析，为研究与检测工作提供丰富且精准的信息。高达 500 万像素高分辨率相机，更是能够对经过加工的表面，进行细致入微的三维数据可视化呈现，让每一处细节都清晰可见。

精确测量，深植于经验的土壤，依托专业知识的支撑，更离不开我们所信赖的专家与前沿技术。让我们一同深入幕后，探寻 TopMap的发展脉络，走近其背后的杰出团队，结识 PolyX的精英专家们。即刻启程，加入我们的精彩征程！

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亮点

  • 纳米级分辨率的高端白光干涉仪
  • 采用CST连续扫描技术可达到100毫米垂直测量范围
  • 配有自动“对焦仪”和“对焦跟踪器”进行自动化
  • 电动X，Y，Z，倾斜调平台和转塔无需再重新定位
  • 用于缺陷扩展分析和文档记录的颜色信息模式
  • 使用紧凑型装置可靠地测量表面粗糙度
  • 特定应用目标（新！0.6X 至 111X）

4 年免费保修和终身软件更新

Micro.View+ is a modular optical surface profiler for profound and detailed topography analysis
Micro.View+ is a modular optical surface profiler for profound and detailed topography analysis
TopMap Micro.View+ with automated focus tracking function
Focus Finder and Focus Tracker are ideal for automation surface inspections
Characterize small details and microstructures with sub-nanometer resolution; sample data of an optical polished surface
Characterize small details and microstructures with sub-nm resolution; sample data of an optical polished surface
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
Capture surface areas with high slopes and steep angles; sample data of a dental implant screw
Capture surface areas with high slopes and steep angles; sample data of a dental implant screw
Detailed topography analysis of wafers, lab-on-a-chip and more
Detailed topography analysis of wafers, lab-on-a-chip and more
Color information mode for extended analysis and documentation of defects
Color information mode for extended analysis and documentation of defects
Configuration scheme of the modular optical surface profiler TopMap Micro.View+
Modularity is key to comply with challenging surface topography analysis
Micro.View+ is a modular optical surface profiler for profound and detailed topography analysis
Micro.View+ is a modular optical surface profiler for profound and detailed topography analysis
TopMap Micro.View+ with automated focus tracking function
Focus Finder and Focus Tracker are ideal for automation surface inspections
Characterize small details and microstructures with sub-nanometer resolution; sample data of an optical polished surface
Characterize small details and microstructures with sub-nm resolution; sample data of an optical polished surface
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
Capture surface areas with high slopes and steep angles; sample data of a dental implant screw
Capture surface areas with high slopes and steep angles; sample data of a dental implant screw
Detailed topography analysis of wafers, lab-on-a-chip and more
Detailed topography analysis of wafers, lab-on-a-chip and more
Color information mode for extended analysis and documentation of defects
Color information mode for extended analysis and documentation of defects
Configuration scheme of the modular optical surface profiler TopMap Micro.View+
Modularity is key to comply with challenging surface topography analysis

启用自动化且可投入生产线

编码和电动转塔确保了物镜之间的无缝过渡。 Micro.View+ 采用最新的“对焦仪”和“焦点追踪器”，使表面在任何情况下都保持聚焦。 采用全电动的样品定位台可实现缝合和自动化。

以 3D 方式表征小细节和微观结构，以亚纳米分辨率评估区域表面粗糙度 Sa，并以干涉精度评估甚至陡峭的角度。 Micro.View 和 Micro.View+ 是基于相干扫描技术 (CSI) 的表面轮廓仪，无论物镜放大倍数如何，都能提供出色的垂直分辨率。采用连续扫描技术 (CST)、100 毫米 Z 轴行程和 100 毫米相等的垂直测量范围、高达 5 MP 的相机、从 2.5X（0.6X！）到 111X 的各种物镜，包括长工作距离选项和玻璃补偿，并预设ISO参数包括ISO 25178、ASME B46.1、ISO 4287、ISO 13565、ISO 21920...

 

申请演示

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In Measurement System Analysis (MSA) the measurement uncertainty (b > a) leads to an increase in the observed process variation as well as in the areas at the tolerance limits in which no reliable decision can be made.
In Measurement System Analysis (MSA) the measurement uncertainty (b > a) leads to an increase in the observed process variation as well as in the areas at the tolerance limits in which no reliable decision can be made.
Based on n measured values x, the capability figures Cg and Cgk are determined providing a ratio between the tolerance T and the variation caused by the measurement equipment (standard deviation s)
Based on n measured values x, the capability figures Cg and Cgk are determined providing a ratio between the tolerance T and the variation caused by the measurement equipment (standard deviation s)
To determine the GRR value in Measurement System Analysis, several measurement objects are measured several times by several operators
To determine the GRR value in Measurement System Analysis, several measurement objects are measured several times by several operators
In Measurement System Analysis (MSA) the measurement uncertainty (b > a) leads to an increase in the observed process variation as well as in the areas at the tolerance limits in which no reliable decision can be made.
In Measurement System Analysis (MSA) the measurement uncertainty (b > a) leads to an increase in the observed process variation as well as in the areas at the tolerance limits in which no reliable decision can be made.
Based on n measured values x, the capability figures Cg and Cgk are determined providing a ratio between the tolerance T and the variation caused by the measurement equipment (standard deviation s)
Based on n measured values x, the capability figures Cg and Cgk are determined providing a ratio between the tolerance T and the variation caused by the measurement equipment (standard deviation s)
To determine the GRR value in Measurement System Analysis, several measurement objects are measured several times by several operators
To determine the GRR value in Measurement System Analysis, several measurement objects are measured several times by several operators

指导原则： 测量系统分析基础

无论是触觉式还是光学式表面轮廓仪，每次测量都存在不确定性。获得的测量值是质量控制生产的基础，因此也是质量保证的关键组成部分。然而，通过测量得出的任何结论是否正确，不仅取决于参数是否合适，还取决于测量值能否准确可靠地反映实际情况。只有在测量值的不确定性与特性公差的关系足够小的情况下，测量过程才适合检测任务。本文介绍了测量系统分析 (MSA) 的方法和有用的能力数据。

在免费指南中了解如何处理质量保证中的测量不确定性！

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