Characterizing flexible electronics in 3D

Flexible electronics open up a realm of new applications in the fields of wearables, thin film solar cells, RFIDs and displays used in automotive dashboards or medical applications. For all these use cases, the product reliability is a key quality indicator. Also there is an increasing demand in components to be harmonized for signal processing, communication and energy generation. For such applications, white-light interferometry allows scanning the entire surface of hybrid flexible electronics in a single shot. The optical and non-destructive measurement method characterizes printed electronics on behalf of form parameters, roughness and structural details and help secure the electronics quality and functionality.

Form parameters & surface roughness of printed electronics

Scanning surfaces and evaluating 3D height information enables a fast and reliable characterization of printed and flexible electronics. 3D surface metrology solutions from Polytec provide meaningful data for both electronics quality and printed electronics process stability. The advanced color information mode helps determining and localizing defects.

For in-line integration and for semi- or fully automated manufacturing processes of flexible electronics, TopMap sensor heads can easily be integrated into production lines, offering customized solutions for in-line inspection. Upon demand, users can manage and load predefined measurement settings, enabling one-click inspections at production level using measurement recipes. Our PolyXperts are happy to assist at all project stages, such as developing custom routines and evaluations, using the open software architecture.

For more information about how to master electrically conductive bonding of flexible electronics, visit the Polytec PT section for polymer technology solutions.

Characterziation of micro electronics

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