微结构和微技术计量学

微结构静态形貌测量

Microstructures and MEMS as micro-electromechanical systems must comply with tight tolerances in order to guarantee functionality and the life-time. Physical influences on the microscopic structures should be avoided. Therefore, optical non-contact surface characterization is key to inspecting microtechnology in a non-destructive and non-invasive way, evaluating surface parameters like form and roughness. Polytec optical metrology solutions  provide non-reactive and reproducible measurements on microstructures and microsystems.

TopMap 3D surface metrology characterizes microstructures based on coherence scanning interferometry, scanning height data and collecting millions of measurement data on an entire surface within a few seconds regardless of the materials - whether matt or rough texture after CNC machine processing or smooth and reflective like wafers. Smart surface scanning technology facilitates measurements on varying reflective areas of a test specimen. Typical static topography measurements of microstructures are used on microsensors and actuators, investigations on structured metal sheets, sealing surfaces or machined surfaces, where proper lubrication must be secured, or research and development of biomedical samples for cosmetics and medical technology.

测量微机电系统的动态运动和功能

Active micro-electromechanical components such as MEMS actuators and MEMS sensors demand sophisticated optical measurement technology, since electrical characterization alone is not sufficient. The line of MSA Micro System Analyzers from Polytec is designed for the thourough characterization of the dynamic behaviour of microsystems. These MEMS testing systems enable the precisely assesment of both the high-resolution surface topography and the dynamic component like motion. The dynamic measurement uses laser Doppler vibrometry, allowing for broadband measurements up to the GHz range, visualizing mode shapes of components with a high amplitude resolution and true phase, often used for model validation. The patented IRIS technology even captures MEMS dynamics through intact Si encapsulation, enabling to test MEMS in final state. Find out more here!

动态微机电系统表征