微结构测量与微技术测试

在消费电子、汽车、可穿戴设备以及医疗科技等领域，功能组件的小型化催生了大量的应用与创新。微机电系统（MEMS）和微光学技术对精密测试有着极高的要求，给相应的测量技术和测试工具带来了新的挑战。复杂的微结构需要进行全面的分析，最为理想的是开展高分辨率（ μm ~ nm 级别）的面扫描检测，从而深入了解其质量与功能方面的特性。

Polytec 的光学测量解决方案，不仅能够对表面的形貌、形状以及结构细节进行表征，还可以对微机电系统和微系统的动态运动情况以及性能表现进行测试 。
 

如何检测表面形貌、表面光洁度或微结构?

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Areal surface profile of MEMS pressure sensor (courtesy: CIS) as 2D/3D profile
Areal surface profile of MEMS pressure sensor (courtesy: CIS) as 2D/3D profile. Courtesy: CiS Forschungsinstitut für Mikrosensorik GmbH
Analyze MEMS and microsystems form, topography and capture height data on an entire area
Analyze MEMS and microsystems form, topography and capture height data on an entire area
Assesment of biomedical probes like LOC (Lab-on-a-Chip) devices, evaluating channel depth, parallelism or defined micro roughness for fluid transportation
Assesment of biomedical probes like LOC (Lab-on-a-Chip) devices, evaluating channel depth, parallelism or defined micro roughness for fluid transportation
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
Characterize small details and microstructures with sub-nanometer resolution; sample data of an optical polished surface
Characterize small details and microstructures with sub-nm resolution; sample data of an optical polished surface
Micro roughness with cross section of a wafer surface
Micro roughness with cross section of a wafer surface
Analyze microstructure topography with nanometer resolution
Analyze microstructure topography with nanometer resolution
Areal surface profile of MEMS pressure sensor (courtesy: CIS) as 2D/3D profile
Areal surface profile of MEMS pressure sensor (courtesy: CIS) as 2D/3D profile. Courtesy: CiS Forschungsinstitut für Mikrosensorik GmbH
Analyze MEMS and microsystems form, topography and capture height data on an entire area
Analyze MEMS and microsystems form, topography and capture height data on an entire area
Assesment of biomedical probes like LOC (Lab-on-a-Chip) devices, evaluating channel depth, parallelism or defined micro roughness for fluid transportation
Assesment of biomedical probes like LOC (Lab-on-a-Chip) devices, evaluating channel depth, parallelism or defined micro roughness for fluid transportation
High-resolution roughness measurement <1nm; sample data of a polished silicon surface
Characterize small details and microstructures with sub-nanometer resolution; sample data of an optical polished surface
Characterize small details and microstructures with sub-nm resolution; sample data of an optical polished surface
Micro roughness with cross section of a wafer surface
Micro roughness with cross section of a wafer surface
Analyze microstructure topography with nanometer resolution
Analyze microstructure topography with nanometer resolution

微结构静态形貌测量

微结构及微机电系统 MEMS，需严格契合公差标准，才能保障功能稳定与使用期限，同时要避免微观结构遭受物理损伤。因此，非接触式光学表面特性分析，是无损检测微技术、评估表面形状与粗糙度等参数的关键。Polytec 光学计量解决方案，可对微结构和微系统开展无干扰、可重复测量。​

TopMap 3D 表面测量基于相干扫描干涉技术，能扫描高度数据，数秒内采集数百万个表面测量数据，不受材料限制，无论是数控加工后的粗糙材质，还是晶圆类光滑反光材料，都能精准测量。其智能表面扫描技术，可轻松测量样本的不同反射区域。​

微结构静态形貌测量广泛应用于微传感器、微执行器检测，金属纹理板、密封表面或机加工表面研究 —— 这些场景都需确保良好润滑。此外，在化妆品、医疗技术领域的生物医学样本研发中，该技术也发挥着重要作用。

White-light interferometers for ab-on-a-chip manufacturing
White-light interferometers for ab-on-a-chip manufacturing

Interview

Out-of-plane topography of 3D surface micromachined microsensors
Out-of-plane topography of 3D surface micromachined microsensors

Article

Quality control of optical polishing and optical components
Quality control of optical polishing and optical components

Application note

Surface quality of watch & clock parts
Surface quality of watch & clock parts

Article

Surface quality control in coating processes
Surface quality control in coating processes

Application note

TopMap Micro.View & Micro.View+
TopMap Micro.View & Micro.View+

Measurement capability and performance of optical profilers

测量您的微机电系统（MEMS）和微结构，并与您一同展开分析

申请演示
Non-contact analysis of tiny mechanical and biological probes in 3D
Non-contact analysis of tiny mechanical and biological probes in 3D
Full-field, optical vibration analysis of a combdrive at 6.8 kHz
Full-field, optical vibration analysis of a combdrive at 6.8 kHz
Micro System Analyzer IRIS using IR laser for measuring MEMS through Si caps in final state
Micro System Analyzer IRIS using IR laser for measuring MEMS through Si caps in final state
Vibration measurement as a service for modal testing inside Si capped MEMS
Vibration measurement as a service for modal testing inside Si capped MEMS
MSA-650 IRIS patented measrurement technology for analysis on Si capped MEMS
MSA-650 IRIS patented measrurement technology for analysis on Si capped MEMS
MEMS cantilever resolved in time and frequency domain with optical vibration measurement from Polytec
MEMS cantilever resolved in time and frequency domain with optical vibration measurement from Polytec
Non-contact analysis of tiny mechanical and biological probes in 3D
Non-contact analysis of tiny mechanical and biological probes in 3D
Full-field, optical vibration analysis of a combdrive at 6.8 kHz
Full-field, optical vibration analysis of a combdrive at 6.8 kHz
Micro System Analyzer IRIS using IR laser for measuring MEMS through Si caps in final state
Micro System Analyzer IRIS using IR laser for measuring MEMS through Si caps in final state
Vibration measurement as a service for modal testing inside Si capped MEMS
Vibration measurement as a service for modal testing inside Si capped MEMS
MSA-650 IRIS patented measrurement technology for analysis on Si capped MEMS
MSA-650 IRIS patented measrurement technology for analysis on Si capped MEMS
MEMS cantilever resolved in time and frequency domain with optical vibration measurement from Polytec
MEMS cantilever resolved in time and frequency domain with optical vibration measurement from Polytec

MEMS 动态测量

主动式微机电元件（如 MEMS 执行器和传感器）仅靠电气表征不够，需先进光学测量技术。Polytec的MSA 显微式激光测振仪，可全面表征微系统动态特性。该 MEMS 测试系统能精准评估高分辨率表面形貌和元件动态特性。

测量技术

其动态特性测量运用激光多普勒测振技术，可进行 GHz 宽带测量，高分辨率呈现元件模态振型和真实相位，常用于模型验证。专利 IRIS 技术可透过硅封装检测 MEMS 动态，实现成品测试。

动态微机电系统表征

Ultra high frequency performance testing of microsystems
Ultra high frequency performance testing of microsystems

Application note

Out-of-plane topography of 3D surface micromachined microsensors
Out-of-plane topography of 3D surface micromachined microsensors

Article

Excitation of multi-cantilever MEMS structure
Excitation of multi-cantilever MEMS structure

Article

Performance characterization of microelectromechanical biosensors
Performance characterization of microelectromechanical biosensors

Article

Characterizing dynamics of MEMS devices at wafer-level using optical measurement
Characterizing dynamics of MEMS devices at wafer-level using optical measurement

Article

MSA-600 Micro System Analyzer
MSA-600 Micro System Analyzer

Brochure

Analyze the texturing of machined metal parts

微结构的接触式与光学测量方法对比

接触式表面测量技术在微结构分析上存在局限性。借助二维轮廓线，难以获取整个表面的复杂结构细节，且测量耗时久。这类测量常以粗糙度轮廓线为参考，开展后续评估。此外，触针测量会在表面留痕、造成自身磨损，影响测量重复性。

非接触式光学检测技术，在机械工程精密表面检测中优势突出。它测量可重复，不会产生废品，在全表面测量和 100% 抽检场景下，效率更高、成本更低。

我们可为您测量样品，并通过免费可行性研究，展示实际成效！

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info-cn@polytec.com