Control epoxy die bonding by surface characterization
In epoxy die bonding and any related die attach processes, the accurate placement and attachment of the die is crucial for process stability and the resulting component quality. The adhesive thickness or also bond line thickness (BLT) is key for a reliable die attach to a lead frame or other substrates. TopMap surface profilers from Polytec allow an automatic and reliable determination of the die orientation on the lead frame including the die tilt as well as bond line thickness measurement. This non-contact measuring method enables a fast, simple and reliable quality control of the die bonding process.
Characterizing QFN packages (quad-flat no-leads)
3D surface metrology solutions from Polytec are easy to integrate into production lines and provide automated and high resolution in-process measurement in expoy die bonding processes. Typical measurements are the determination of the die tilt, the bond line thickness measurement (BLT), the BLT height or die/ chip positioning as well as torsional information and relative measurement to a reference position.
In quad-flat no-leads (QFN) packages as one of the typical chip connect types in integrated circuits, the die attach fillet is an excess climbing on the edge of the die. It provides mechanical strength along the die edges. Based on the measured bond line thickness, the useful and optimized parameters can be derived, such as width of the fillet, height of the fillet from the pad, slope of rise of the fillet or the slope angle.
Related products
TopMap Micro.View
TopMap Micro.View® is an easy to use and compact optical profiler. Choose Micro.View® as the cost-effective quality control solution for surface analysis of precision-engineering, for inspecting roughness, microstructures and more surface details.
TopMap Micro.View+
TopMap Micro.View®+ is the next generation optical surface profiler in a modular design to reliably measure the most challenging analysis tasks regarding surface finish and microstructures with utmost precision. Focus Finder and Focus Tracker assist in keeping samples focused at all times, with fully motorized positioning units ready for automation. Find out more!
TopMap Pro.Surf+
The all-in-one 3D optical surface profiler from Polytec. The precision of a white-light interferometer, complemented by chromatic confocal sensors to overcome form deviations and any roughness determined with one device. Pro.Surf+ measures topography over a large area and, in so doing, characterizes structures with nanometer resolution.
Further applications in electronics, semiconductors and solar
- Flexible electronics
![Surface analysis and and quality control on flexible electronics and printed electronics]( "Surface analysis and and quality control on flexible electronics and printed electronics")
Surface analysis and and quality control on flexible electronics and printed electronics - Mobile devices
![Production testing of components for mobile devices using 3D optical surface metrology]( "Production testing of components for mobile devices using 3D optical surface metrology")
Production testing of components for mobile devices using 3D optical surface metrology - Pass/fail analysis
![Multi-sample pass-fail analysis in manufacturing]( "Multi-sample pass-fail analysis in manufacturing")
Multi-sample pass-fail analysis in manufacturing - Roughness
![Non-contact surface roughness measurement in an areal 3D profile]( "Non-contact surface roughness measurement in an areal 3D profile")
Non-contact surface roughness measurement in an areal 3D profile - Layer thickness
![Optical and areal step edge test showing a 75.2 nm thick coating]( "Optical and areal step edge test showing a 75.2 nm thick coating")
Optical and areal step edge test showing a 75.2 nm thick coating - Surface parameters
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