Control epoxy die bonding by surface characterization
In epoxy die bonding and any related die attach processes, the accurate placement and attachment of the die is crucial for process stability and the resulting component quality. The adhesive thickness or also bond line thickness (BLT) is key for a reliable die attach to a lead frame or other substrates. TopMap surface profilers from Polytec allow an automatic and reliable determination of the die orientation on the lead frame including the die tilt as well as bond line thickness measurement. This non-contact measuring method enables a fast, simple and reliable quality control of the die bonding process.
Characterizing QFN packages (quad-flat no-leads)
3D surface metrology solutions from Polytec are easy to integrate into production lines and provide automated and high resolution in-process measurement in expoy die bonding processes. Typical measurements are the determination of the die tilt, the bond line thickness measurement (BLT), the BLT height or die/ chip positioning as well as torsional information and relative measurement to a reference position.
In quad-flat no-leads (QFN) packages as one of the typical chip connect types in integrated circuits, the die attach fillet is an excess climbing on the edge of the die. It provides mechanical strength along the die edges. Based on the measured bond line thickness, the useful and optimized parameters can be derived, such as width of the fillet, height of the fillet from the pad, slope of rise of the fillet or the slope angle.
Bond line thickness, film and layer thickness measurement in 3D
Related products
TopMap Micro.View
TopMap Micro.View® is an easy to use optical profiler in a compact table-top setup. Choose Micro.View® as the cost-effective inspection tool for examining precision-engineered surfaces down to the sub-nm range, for inspecting roughness, microstructures and more surface details. Custom objectives 0.6x to 111x and stage options allow for application-specific finetuning.
TopMap Micro.View+
TopMap Micro.View®+ is the next generation optical surface profiler in a modular design to measure challenging workpiece textures, surface finish and microstructures or MEMS with sub-nm resolution. Focus Finder and Focus Tracker assist in keeping samples focused at all times along the exceptionally large 100 mm Z range, with fully motorized positioning ready for both labs and automation. Challenge it now!
TopMap Pro.Surf+
The multi-sensor profilometry system measures areal topography and form on an exceptionally large field-of-view (up to 230x220 mm) like common for Pro.Surf – while adding the .--chromatic-confocal sensor for complementary roughness line profile evaluation. Fast scanning, repeatable measurements for combined form & roughness characterization resolved in the nm range.
Further applications
- Flexible electronics
![Surface analysis and and quality control on flexible electronics and printed electronics]( "Surface analysis and and quality control on flexible electronics and printed electronics")
Surface analysis and and quality control on flexible electronics and printed electronics - Ball grid array (BGA)
![bump measurement on a ball grid array (BGA) as 3D profile]( "bump measurement on a ball grid array (BGA) as 3D profile")
bump measurement on a ball grid array (BGA) as 3D profile - High power laser diodes
![Inspection of flatness and step-height on high power LED]( "Inspection of flatness and step-height on high power LED")
Inspection of flatness and step-height on high power LED - Mobile devices
![Production testing of components for mobile devices using 3D optical surface metrology]( "Production testing of components for mobile devices using 3D optical surface metrology")
Production testing of components for mobile devices using 3D optical surface metrology - Pass/fail analysis
![Multi-sample pass-fail analysis in manufacturing]( "Multi-sample pass-fail analysis in manufacturing")
Multi-sample pass-fail analysis in manufacturing - Surface roughness
![Non-contact surface roughness measurement in an areal 3D profile]( "Non-contact surface roughness measurement in an areal 3D profile")
Non-contact surface roughness measurement in an areal 3D profile - Layer thickness
![Optical and areal step edge test showing a 75.2 nm thick coating]( "Optical and areal step edge test showing a 75.2 nm thick coating")
Optical and areal step edge test showing a 75.2 nm thick coating - Surface parameters
![Surface parameter characterizing the form, waviness and texture of a workpiece]( "Surface parameter characterizing the form, waviness and texture of a workpiece")
Surface parameter characterizing the form, waviness and texture of a workpiece
