Surface topography and dynamic motion analysis and visualization are key to testing and developing microstructures such as MEMS devices (Micro-Electro-Mechanical Systems). They are indispensable for validating FE calculations, determining cross-talk effects and measuring surface deformation. The MSA-600 Micro System Analyzer is the all-in-one optical measurement workstation for characterizing surface topography as well as in-plane and out-of-plane motions.
The versions MSA-600-M/V cover frequency ranges up to 25 MHz, ideally suited for MEMS, MEMS microphones and other microsystems. The versions MSA-600-X/U cover the high and very high frequency range up to 2.5 GHz, perfect for the assessment of HF MEMS resonators, micro-acoustic devices like SAW, BAW and more.
- All-in-one optical measurement workstation for microstructures
- Real-time response measurement (no post-processing required)
- Versions MSA-600-M/V with up to 25 MHz
- Versions MSA-600-X/U with up to 2.5 GHz
- Unparalleled sub-pm displacement resolution
- Fast measurement and visualization of deflection shapes
- Straightforward and intuitive operation
- Automated system for easy integration into probe stations
- Import / export options for FE model validation
All-in-one optical measurement solution for MEMS
The MSA-600 Micro System Analyzer delivers increased measurement flexibility and precision, adapting to the needs of today’s and tomorrow’s microstructures. The Micro System Analyzer provides precise 3D dynamic and static response data that increases device performance while reducing development and manufacturing costs. Thus it enhances and shortens design cycles, simplifies trouble shooting and improves yield.
The high-performance laser Doppler vibrometer delivers fast, real-time response measurement with sub-pm displacement resolution. And the white-light interferometer option provides millions of 3D surface data in seconds. Complemented by its straightforward operation and intuitive user interface, the MSA-600 is the powerful optical measurement solution in research, development (R&D) and quality control (QC). Compatible with common probe stations, the micro system analyzer helps you in all stages of development – from MEMS prototyping to testing and troubleshooting – and thus helps you to cut production costs and also shorten the time to market.
A-MOB-xxxx Bright Field Objectives
For out-of-plane and in-plane vibration measurement. Available magnifications: 1x, 2x, 5x, 10x, 20x, 50x, 100x and 3.6x, 10x for large working distances.
A-STD-TST-01 Test Stand
Test stand providing ample workspace. With motorized z-axis, travel range 200 mm.
A-STD-BAS-02 Base Stand
Rigid support for the sensor head. Includes manual focus block with 100 mm travel range with coarse and fine drive. Interfaces to commercially available optical tables.
A-STD-F50 Focus Block
Travel Range 50 mm. With coarse and fine drive for manual z-axis adjustment of the sensor head. Interfaces with commercially available wafer probe stations.
A-TAB-AIR-01 Active Vibration Isolation Table
Air-damped vibration isolation table with active level adjustment. Compatibility: A-STD-TST-01 Test Stand, A-STD-BAS-02 Base Stand.
A-TAB-ELC-01 Active Vibration Isolation Table
Electronically controlled voice coil stabilization for highest isolation performance. Compatibility: A-STD-TST-01 Test Stand, A-STD-BAS-02 Base Stand.
Workstation for use with Polytec's A-TAB-AIR-01 and A-TAB-ELC-01 Active Vibration Isolation Tables.
Breadboard with metric hole pattern. Footprint 900 mm x 600 mm. Compatibility: A-STD-BAS-02 Base Stand.
A-AVI-MELA Active Vibration Isolation Breadboard
Electronically controlled for highest vibration isolation performance. With metric hole pattern. Footprint 600 x 800 mm. Compatibility: A-STD-BAS-02 Base Stand.
A-ESG-001 External Signal Generator
For high frequency, broadband sample excitation.
MSA-A-WPM Wafer Prober Module
Together with the A-PST-200P XY Positioning Stage, the wafer prober module forms a motorized platform for electrical contacting and high-precision measurement of wafers and substrates up to 200 mm in diameter.