Polytec provides instruments and components for a variety of semiconductor measurement applications: Four-Point-Probes (measurement heads, stands, test instrumentation), as well as hyperspectral measurement instruments for precise surface analysis and layer thickness measurement. These systems enable non-contact inspection of ultra-thin layers from 1 nm to 500 µm and reliably detect defects, contamination, or deviations from production specifications.
3D Surface Metrology for Form Parameters & Roughness
Optical 3D surface measuring instruments from the TopMap family are precision tools for quality control of functional surfaces. TopMap white-light interferometers inspect form parameters such as steps, height, parallelism, waviness, as well as roughness and microstructures in a non-contact manner—whether in research laboratories, on the production floor, or directly integrated into the production line.
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