MSA-600 Micro System Analyzer
Measuring 3D dynamics and topography of MEMS and microsystems
Vibrometry

- Vibrometry
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Products
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Microscope-based vibrometers
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MSA-600 Micro System Analyzer














Measuring 3D dynamics and topography of MEMS
Surface topography and dynamic motion analysis and visualization are key to testing and developing microstructures such as MEMS devices (Micro-Electro-Mechanical Systems). They are indispensable for validating FE calculations, determining cross-talk effects and measuring surface deformation.
All-in-one optical measurement solution for MEMS
The MSA-600 Micro System Analyzer is the all-in-one optical measurement workstation for characterizing surface topography as well as in-plane and out-of-plane motions. This instrument delivers increased measurement flexibility and precision, adapting to the needs of today’s and tomorrow’s microstructures. The Micro System Analyzer provides precise 3D dynamic and static response data that increases device performance while reducing development and manufacturing costs. Thus it enhances and shortens design cycles, simplifies trouble shooting and improves yield.
The high-performance laser Doppler vibrometer delivers fast, real-time response measurement with sub-pm displacement resolution. And the white-light interferometer option provides millions of 3D surface data in seconds. Complemented by its straightforward operation and intuitive user interface, the MSA-600 is the powerful optical measurement solution in research, development (R&D) and quality control (QC). Compatible with common probe stations, the micro system analyzer helps you in all stages of development – from MEMS prototyping to testing and troubleshooting – and thus helps you to cut production costs and also shorten the time to market.
- All-in-one optical measurement workstation for microstructures
- True real-time response measurement up to 2.5 GHz (no post-processing required)
- Unparalleled sub-pm displacement resolution
- Fast measurement and visualization of deflection shapes
- Straightforward and intuitive operation
- Automated system for easy integration into probe stations
- Import / export options for FE model validation
Optical Accessories | |
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A-MOB-xxxx Bright Field Objectives For out-of-plane and in-plane vibration measurement. Available magnifications: 1x, 2x, 5x, 10x, 20x, 50x, 100x and 3.6x, 10x for large working distances. |
Tripods, Test Stands, Positioning Stages | |
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A-STD-TST-01 Test Stand Test stand providing ample workspace. With motorized z-axis, travel range 200 mm. |
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A-STD-BAS-02 Base Stand Rigid support for the sensor head. Includes manual focus block with 100 mm travel range with coarse and fine drive. Interfaces to commercially available optical tables. |
A-STD-F50 Focus Block Travel Range 50 mm. With coarse and fine drive for manual z-axis adjustment of the sensor head. Interfaces with commercially available wafer probe stations. |
Vibration Isolation, Breadboards | |
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A-TAB-AIR-01 Active Vibration Isolation Table Air-damped vibration isolation table with active level adjustment. Compatibility: A-STD-TST-01 Test Stand, A-STD-BAS-02 Base Stand. |
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A-TAB-ELC-01 Active Vibration Isolation Table Electronically controlled voice coil stabilization for highest isolation performance. Compatibility: A-STD-TST-01 Test Stand, A-STD-BAS-02 Base Stand. |
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A-WST-001 Workstation Workstation for use with Polytec's A-TAB-AIR-01 and A-TAB-ELC-01 Active Vibration Isolation Tables. |
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A-BBO-ME02 Breadboard Breadboard with metric hole pattern. Footprint 900 mm x 600 mm. Compatibility: A-STD-BAS-02 Base Stand. |
A-AVI-MELA Active Vibration Isolation Breadboard Electronically controlled for highest vibration isolation performance. With metric hole pattern. Footprint 600 x 800 mm. Compatibility: A-STD-BAS-02 Base Stand. |
Miscellaneous | |
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A-ESG-001 External Signal Generator For high frequency, broadband sample excitation. |
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MSA-A-WPM Wafer Prober Module Together with the A-PST-200P XY Positioning Stage, the wafer prober module forms a motorized platform for electrical contacting and high-precision measurement of wafers and substrates up to 200 mm in diameter. |
Wafer-level and single-die testing
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