Characterizing vertical interconnect accesses (VIA)

Vertical electrical connections – also known as “vertical interconnect accesses” or VIAs for short – are mainly used in high-density, integrated switching circuits and have structures with a high aspect ratio. TSVs (through silicon VIAs) in particular have become an established technology in the semiconductor segment. Polytec's optical surface metrology allows easy and reliable quality inspections: check etching depths in automated processes, measure distances and surface parameters on VIA. Chromatic confocal sensors and microscope-based profilers offer versatile measurement capabilities, for both in the laboratory and at production level and inline.

Your PolyXpert in Surface-Metrology