About ICTA 2026
The IEEE ICTA 2026 provides an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilisation of IC designs, technologies, and applications in our fast-changing society. This year’s theme is “Advancing IC with AI”. ICTA 2026 welcomes papers of new and innovative discoveries and designs.
Join us for inspiring keynote and plenary talks, exhibitions, posters, special sessions, and global networking opportunities.
What Polytec Will Showcase at ICTA 2026
Polytec will demonstrate how non-contact optical measurement supports semiconductor development, process control and quality assurance—from wafer-level structures to advanced packaging and assembled electronic components.
- Precision Metrology for AI-Driven IC Manufacturing
Reliable 3D measurement data helps engineers understand process variations, verify critical dimensions and improve manufacturing consistency. - Applications Across the IC Manufacturing Process
Explore measurement solutions for wafers, substrates, dies, lead frames, tape frames, semiconductor packages, MEMS and PCB assemblies. - Micro-to-Macro Measurement Capability
Measure fine local structures as well as larger component surfaces using flexible, non-contact optical measurement technology. - Critical Surface and Dimensional Parameters
Evaluate surface topography, roughness, flatness, step height, coplanarity, warpage, wafer bow and other important form parameters. - Advanced Packaging and Interconnection
Inspect BGA surfaces, solder bump height and uniformity, package deformation, die-bonding features and wire-bonding-related structures. - MEMS Surface Characterization
Measure the 3D topography, form, flatness, step height and surface roughness of MEMS sensors, actuators, membranes and other microstructures. - MEMS Dynamic Characterization
Polytec optical measurement solutions can also capture resonance frequencies, vibration amplitudes, frequency responses, damping behaviour and operational deflection shapes without adding mass to delicate MEMS structures. - From Development to Quality Control
Use reliable measurement results to compare designs, validate simulations, identify dimensional deviations and support production inspection.
Let’s talk metrology & MEMS
Meet the Polytec team at ICTA 2026 to discuss your measurement challenges at any stage of the IC manufacturing process.