Micro & Nano Technology
MEMS (micro-electro-mechanical systems) are tiny microsensors and micro-actuators that are found in entertainment systems, guidance systems, automobiles, aircraft, computers and medical devices. R&D and production engineers must develop new devices quickly, precisely and cost-effectively. Polytec's innovative, non-contact optical metrology enables the systematic testing of dynamic mechanical response to important electrical and physical inputs, working with resolutions in the nanometer range and below. Fine 3-D surface structures can be measured by white-light interferometry also at the nanometer scale.
“We have been using Polytec vibrometers for several years to characterize the dynamics of microsystems (MEMS) and nanosystems (NEMS). The level of support has been consistently excellent. The onsite visits for installation, calibration, and training are a major highlight. The engineers from Polytec are generous with their knowledge and experience, and our students benefit greatly from these visits.”
Srikar Vengallatore, Associate Professor and Canada Research Chair, McGill University, Montreal, Quebec, Canada
Validation of Simulation Models
MEMS researchers use various engineering tools to take a design from concept to simulation, prototyping and testing. Simulation models are validated and fine-tuned through comparisons with precise experimental data. By using light as the probe, the measurement procedure has virtually no influence on the MEMS device.
Improving MEMS Reliability
It is very important to determine reliability under mechanical excitation, radiation, temperature, humidity and pressure stress by targeting the device inside an environmental or vacuum chamber. The Micro System Analyzer has a stand-off distance that allows the researcher to characterize static and dynamic behavior under specific environmental conditions.
Find Parameters Relevant to Manufacturing
Information about current process parameters and their impact on dimensions and material parameters of the MEMS devices is needed to control the manufacturing process. For instance, when silicon-on-insulator technology is used to build three-dimensional micro-machined sensors and actuators, topographic analysis is critical to their development.
WAFER-LEVEL PRODUCTION TESTING
Wafer-level testing can save money by the early characterization and selection of devices prior to packaging. For this task the MSA-500 can easily be integrated into automated and semi-automated probe stations. Fast measurement allows high throughput and is an important tool to monitor the manufacturing process.