Checking solder bumps quickly

Unenclosed semiconductor chips are often connected via "bumps" in the flip-chip bonding process. The coplanarity of the bumps is crucial to ensure a correct and properly functioning electrical connection between the individual contact surfaces of the chip and the enclosure. With TopMap surface metrology, you can quickly and precisely check the height of solder bumps and coplanarity - even over large areas without stitching.

Your PolyXpert in Surface-Metrology