Checking solder bumps quickly

Unenclosed semiconductor chips are often connected by “bumps” in the flip chip bonding method. The bumps’ co-planarity is decisive in ensuring that the electrical connection between the chip’s individual contact surfaces and the enclosure is correct and working properly. TopMap surface measurement systems from Polytec help you to quickly check the height of solder bumps and the co-planarity with a high level of precision.

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