Surface-Metrology
Measuring the Dynamics and Topography of MEMS
Using the versatile surface measurement systems from Polytec, you can complete your micro and nano technology tasks reliably, quickly and with a high level of precision.
You can eject channel depths on your lab-on-a-chip, determine the step height on MEMS packaging, establish how flat pressure sensors are and analyze MEMS using surface parameters.
Even performing dynamic out-of-plane and in-plane measurements on RF filters to determine MHz resonance frequencies will be a simple task for you now – thanks to Polytec’s Micro System Analyzer series.
Securing the functionality of lab-on-a-chip devices
Microfluidic lab-on-a-chip devices (LOC) implement a multitude of occurring processes on the smallest of spaces. You can use Polytec’s sophisticated quality products to check, for example, the dimensions of microfluidic channels and find out how deep and wide the channels are, to determine the volume or to localize the flatness of your entire “laboratory”. No matter what LOC applications you’re deploying, Polytec offers you the perfect high-resolution solution for flexible use.
The TopMap Pro.Surf with a large measuring field and high z-axis resolution records an entire LOC’s channel depths with just one measurement. The telecentric, optical configuration has a parallel light beam path, which can be used to measure the channel base almost entirely without any shadowing effects.
Keeping the z-axis resolution constant, the TopMap µ.Lab quickly and easily adapts the lateral resolution to changing measuring tasks by changing lenses.
The TopSens point sensors enable a fast effective profile recording for checking relevant production parameters inline.
Related products
TopMap Pro.Surf
Ideal for quick and precise 3D surface characterization. The areal measurement of the TopMap Pro.Surf ensure to not miss any details when inspecting your workpiece surface. Short measuring times and a large field-of-view characterize the TopMap Pro.Surf.
Reliable and Quick Microsystem Optimization
Polytec offers you a wide range of suitable products to characterize a multitude of different microelectromechanical systems – known as MEMS for short – such as accelerometers, pressure sensors, RF filters, labs-on-a-chip, gyroscopes and many more. They combine speed and precision with simple operability. You can use these products to reliably analyze the step height, parallelism, flatness and form.
Even structures in the µm range can be measured with no problem with the TMS-1200 microscope system thanks to excellent lateral and vertical resolution. You can also achieve outstanding z-axis resolution with the TMS-500 TopMap Pro.Surf or the TMS-350 TopMap In.Line for MEMS and sensor packaging characterization. If static measurement results are not sufficient for you, then you would be better opting for the Polytec MSA-500 Micro System Analyzer for dynamic measurements. In addition to using it for surface metrology operations, you can use it to characterize mechanical in-plane and out-of-plane resonances too.
Polytec’s configurable, chromatic confocal TopSens sensors can be used in a wide range of potential applications to measure different materials with an outstanding level of accuracy. Since the point sensors were especially developed for use in industrial processes, they can be quickly and easily adapted to your existing set-up.
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Related products
TopMap In.Line
The TopMap In.Line’s compact design means it can be easily integrated into the production line and quickly carries out checks on differently reflective surfaces. Steps, larger ripples or other surface structures do not pose any problems here.
TopMap Pro.Surf
Ideal for quick and precise 3D surface characterization. The areal measurement of the TopMap Pro.Surf ensure to not miss any details when inspecting your workpiece surface. Short measuring times and a large field-of-view characterize the TopMap Pro.Surf.
Characterizing Vertical Interconnect Accesses (VIA)
Vertical electrical connections – also known as “vertical interconnect accesses” (VIAs) for short – are mainly used in high-density, integrated switching circuits and have structures with a high aspect ratio. TSVs (through silicon VIAs) in particular have become an established technology in the semiconductor segment.
Polytec’s sophisticated quality products allow you to easily, automatically and reliably check etching depths, distances and surface parameters. The chromatic confocal TopSens point sensors and the microscope system among the TMS-1200 TopMap µ.Lab white-light interferometers offer you versatile measurement capabilities, both in the lab and in production.
