MSA-500 Micro System Analyzer - Features

The MSA-500 Micro System Analyzer is the premier measurement technology for the analysis and visualization of structural vibrations and surface topography in micro structures such as MEMS (Micro-Electro-Mechanical Systems) devices. By fully integrating a microscope with Scanning Laser-Doppler Vibrometry, Stroboscopic Video Microscopy and White Light Interferometry, the MSA-500 is designed with an all-in-one combination of technologies that clarifies real microstructural response and topography. Incorporated in the MEMS design and test cycle, the MSA-500 provides precise 3-D dynamic and static response data that simplifies troubleshooting, enhances and shortens design cycles, improves yield and performance, and reduces product cost.

New Features of the MSA-500 Micro System Analyzer

Seeing Green in MEMS Analysis -New Micro System Analyzer Captures Better Dynamic Data

Inspired by our customers’ measurement requirements on a growing variety of MEMS devices, Polytec has improved the award-winning Micro System Analyzer product line with the introduction of the MSA-500 model.

The new instrument incorporates a sophisticated combination of powerful measurement techniques to characterize dynamic and static properties of microstructures. Scanning Laser Doppler Vibrometry and Stroboscopic Video Microscopy can quickly determine out-of-plane and in-plane dynamic parameters without contact up to several MHz. Scanning white-light interferometry is used for topography analysis with sub-nm resolution.

The MSA-500 has added several new features and options including

Direct geometry scan data acquisition for the vibration measurement
New green LED light source with scan-head-integrated control unit for better performance topography measurements, higher optical resolution and easier setup
Greater choice of microscope objectives and longer working distances
Support for external excitation signals

The All-in-One Solution

Polytec’s Award-Winning Micro System Analyzer

The MSA-500 Micro System Analyzer uses light for non-contact measurement of three-dimensional shape and motion in microstructures: laser-Doppler vibrometry for fast, broadband, out-of-plane dynamics; stroboscopic video microscopy for in-plane motion; and white light interferometry for high resolution topography. These technologies are integrated into a compact, robust and reliable all-in-one measurement head. This outstanding degree of innovation has been recognized by the 2005 Sensor Innovation Award, following the Photonics Circle of Excellence Award for the development of microscope scanning vibrometry.

Superior Dynamic Characterization Compared to Single Technology Solutions

The combination of two complementary measurement techniques for investigating the vibrational behavior of small structures provides superior performance. For example, it can quickly identify, visualize and measure system resonances and transient responses, enhancing overall measurement productivity. This improved efficiency is especially important when integrating the measurement system into automated processes for MEMS production environments. Single technology solutions like ESPI, white light interferometry, and phase shifting interferometry give a much more limited view of small structure response.

Finds All Mechanical Resonances Without A-Priori Information

Using wide-band excitation, the highly sensitive Laser-Doppler technique can rapidly find all mechanical resonances (in-plane and out-of-plane) without a-priori information. In a second step, the stroboscopic video microscopy technique is used to obtain accurate amplitude and phase information of in-plane resonances identified by laser vibrometry.

Convincing Benefits

Rapid identification and visualization of both system resonances and static topography

Integrated microscope optics with optimized optical path for best lateral resolution and highest image quality

Easy integration with MEMS/wafer probe stations

Simple and intuitive operation, measurement ready within minutes

Increased productivity through short measurement cycle

Accelerates product development, troubleshooting and time-to-market

Superior Integration of Technologies

Scanning Laser-Doppler Vibrometry for the Measurement of Out-of-Plane Vibrations

Instrumental in the development of resonant microelectromechanical systems, the Laser-Doppler Vibrometer (LDV) is a very precise optical transducer for determining the vibration velocity and displacement at a sample point. It works by sensing the frequency shift of back scattered
light from a moving surface. By moving the measurement point to predefined positions, a Scanning LDV provides the full picture of a device’s out-of-plane vibrational behavior. There are no discrete frequencies at which measurements must be performed. Instead, frequency data over the instrument’s bandwidth is available within milliseconds per sample point. To learn more about laser-Doppler vibrometry, please visit our Vibrometer University. See Technical Data section for performance details.

Features & Benefits

Full-field vibration mapping and broadband, out-of-plane frequency response information
Displays frequency-domain and time-domain data, simplifying transient response analysis
High density sample grids with up to 512 x 512 user-defined measurement points
Versatile data import and export interfaces to validate FE models
Submicron laser probe spot for measuring very small structures and details
Laser dimmer for optimized measurement conditions

Stroboscopic Video Microscopy for In-Plane Motion Detection

To precisely measure the high frequency, in-plane motion of the device under test, a stroboscopic technique is applied. Using stroboscopic illumination and digital imaging, motions of fast moving objects can be sharply frozen in time to capture the objects’ exact position. The procedure guarantees a high degree of measurement accuracy and a visual real-time analysis in live mode. The system is set to operate on predefined frequency bands selected from out-of-plane vibration measurements. Once set, these multi-band measurements are processed automatically around the selected resonances. See Technical Data section for performance details.

Features & Benefits

Stroboscopic video measurement of in-plane motion with frequencies up to 1 MHz
Time-domain displacement measurements with nanometer resolution
Integrated signal generator for step response, ring down and Bode plot measurements
Time-saving, automatic multi-band processing

White Light Interferometry for the Acquisition of Topography Data

Dynamic MEMS performance is directly linked to the production process parameters that determine the device geometry. With an integrated topography system, the MSA-400 does the full job. A data set with a high spatial resolution and precise Z values for all points is fed into a powerful analysis tool to determine shape, curvature, flatness and roughness. By shifting an interference objective with nanometer precision with respect to the sample, a high resolution X-Y-Z mapping is generated. The objective focuses the interference pattern on to the camera. The user can select the type of data processing, like envelope or phase evaluation, as well as various filtering and masking techniques. For even more capabilities the complementary TMS Report Software package is available. See Technical Data section for performance details.

Features & Benefits

Rapid, non-contact 3-D topography measurement with sub-nanometer resolution
Determination of structure heights and shape on both rough and specular surfaces
Overlay technique copes with different contrast levels and material mixes
Powerful TMS software for topography and surface characterization
2-D and 3-D presentation with video overlay

The System and its Parts

MSA Optical Unit

The MSA Optical Unit is offered in six configurations which allow individual or combined in-plane measurements, out-of-plane measurements or topography measurements. Depending on system type, the optical unit comprises the MSA-400 measurement microscope head with microscope optics as well as a single point (Polytec OFV-551) or differential (Polytec OFV-552) fiber-optic interferometer. In all configurations, the MSA-500 Sensor Head has optimized microscope optics, an integrated LED illumination unit and a progressive scan video camera which provides a live video stream for the DMS. More details >>>

MSA Processing Unit

The MSA-500 Processing Unit comprises the Data Management System with MSA Software, the MSA-E-500 Junction Box and, in system configurations that include vibrometry, the Polytec OFV-5000 Vibrometer Controller. More details >>>

The MSA Software comprises the different programs for data acquisition and evaluation:

Polytec Scanning Vibrometer (PSV) Software for out-of-plane measurements offers quick and easy setups, simple data acquisition and outstanding 3-D data visualization.
Planar Motion Analysis (PMA) Software similarly controls the in-plane measurement process and provides a dynamic visualization.
Topography Measurement System (TMS) Software for data acquisition, analysis, 2-D and 3-D data representation including profile cuts.

Configurations

The MSA-500 Micro System Analyzer can be configured to cover many operating modes and measurement ranges needed to characterize microstructures. The configurations table helps to match the appropriate system to the application. Polytec provides systems for either single-task or combined measurements. For out-of-plane vibration measurements, the system can be configured for either single beam or differential operation. Differential systems can perform both single and differential beam measurements. In addition to the standard 1.5 MHz version, there is a 24 MHz option which features both high frequency data acquisition and a high frequency wave form generator.

Positioning Equipment and Accessories

The Sensor Head can be mounted to a stand provided by Polytec or to a commercially available probe station. Polytec stands are available with vibration isolated workstations or can be installed on user supplied optical tables. The MSA Processing Unit can be mounted in the convenient 19’’ System Cabinet that houses the Vibrometer Controller, Data Management System, Junction Box and cabling, or likewise in the System Cabinet Extension. Both versions keep the electronic components separated from the work surface to reduce the influence of ambient noise on the test specimen. Different types of focus blocks are provided for Z adjustment of the measurement head relative to the measurement object.

For more information about accessories, please contact your local Polytec sales/application engineer.

MEMS Workstation

By combining Polytec’s Micro System Analyzer with a MEMS/Wafer Probe Station the user can concentrate on the dynamic test rather than on sample holding, positioning and contact issues already addressed by probe station technology. Commercially available Probe Stations offer control of the test environment and a stable platform to mount the MEMS tools. Thus, a MSA-500 integrated with a quality general purpose probe station equipped with a thermal chuck system can provide a one-stop workstation to test, repair and encapsulate MEMS devices. For more info download our application report MEMS Workstations: Micro-Motion Analysis, Assemble, Test and Repair.

The mounting holes of the MSA-400 are equivalent to a Mitutoyo FS70-L-S (short base) back plate. Thus it can be attached to most of the commercially available probe stations which have the same array of mounting holes. Please ask your Polytec sales/application engineer for details.