MEMS researchers use various engineering tools to take a design from concept to simulation, prototyping and testing. Simulation models are validated and fine-tuned through comparisons with precise experimental data. By using light as the probe, the measurement procedure has virtually no influence on the MEMS device.

It is very important to determine reliability under mechanical excitation, radiation, temperature, humidity and pressure stress by targeting the device inside an environmental or vacuum chamber. The Micro System Analyzer has a stand-off distance that allows the researcher to characterize static and dynamic behavior under specific environmental conditions.

Information about current process parameters and their impact on dimensions and material parameters of the MEMS devices is needed to control the manufacturing process. For instance, when silicon-on-insulator technology is used to build three-dimensional micro-machined sensors and actuators, topographic analysis is critical to their development.

Wafer-level testing can save money by the early characterization and selection of devices prior to packaging. For this task the MSA-500 can easily be integrated into automated and semi-automated probe stations. Fast measurement allows high throughput and is an important tool to monitor the manufacturing process.